Samsung just announced a groundbreaking LPDDR5X DRAM chip, the thinnest in its category, setting a new benchmark in mobile memory technology. The 12 nm class chips, available in 12 GB and 16 GB packages, are specifically designed for the low-power RAM market, particularly targeting smartphones with on-device AI capabilities.
Measuring just 0.65 mm thin, this new chip is 9% thinner than its predecessor. Samsung estimates that this reduction in thickness will improve cooling efficiency by 21.2%, a significant advancement for high-performance mobile devices. The company’s innovative approach involved optimizing printed circuit board (PCB) and epoxy molding compound techniques, bringing the LPDDR5X thickness down to the size of a fingernail.
The chip is built in a 4-stack structure, where four layers are packaged together, each consisting of two LPDDR DRAMs. This advanced structure not only contributes to its slim profile but also supports enhanced performance and efficiency. Samsung has already started shipping the new thinner chip to manufacturers, marking a significant step forward in mobile memory solutions.
As the demand for high-performance, high-density mobile memory continues to grow, Samsung plans to develop even more advanced solutions. Future developments include 6-layer 24 GB and 8-layer 32 GB modules, which will be designed to fit into the thinnest packages possible, further pushing the boundaries of mobile technology.
With these innovations, Samsung continues to lead the way in the development of cutting-edge memory solutions for the next generation of smartphones. The thinnest LPDDR5X DRAM chip not only enhances device performance but also supports the growing needs of on-device AI, ensuring users experience faster, more efficient mobile technology.
